Sony has announced the upcoming release of a large format 56.73mm diagonal CMOS image sensor ‘IMX661’ for industrial equipment with a global shutter function and the industry’s highest1 effective pixel count of 127.68 megapixels2.
Read more about its main features and key specifications below.
Main features
The industry’s highest effective pixel count of 127.68 megapixels
This new product features a large optical size of 3.6-type (56.73mm diagonal) – that’s nearly ten times larger than the common 1.1-type image sensor corresponded to the C mount lens for industrial equipment. The 3.45 μm pixel size results in a massive pixel count of 127.68 megapixels, which is the industry's highest for a CMOS image sensor equipped with a global shutter.
These features enable a wide viewing angle, high-resolution imaging, and the motion distortion-free imaging demanded on cameras for industrial equipment, thereby improving imaging efficiency and recognition precision.
High-speed image readout
Generally, an increased pixel count means increased signal processing volume, which can cause a drop in frame rate and longer readout times – but not here.
The ‘IMX661’ features Sony's original device configuration, employing a chip-on-wafer process where chips with certain functions are stacked on top of the pixel wafer to allow for optimal positioning of the AD converter. This design improves processing functionality without increasing size.
The new sensor also employs the Scalable Low Voltage Signaling with Embedded Clock (SLVS-EC™)3 high-speed interface standard developed by Sony. These two original technologies enable 127.68 megapixels, 10bits, 21.8fps - a high-speed output data rate nearly four times faster than conventional models4. The dramatic increase in multi-pixel and readout speed greatly contribute to the improvement of productivity in industrial applications.
Equipped with signal processing capabilities
This new product is equipped with a range of signal processing capabilities required for industrial equipment CMOS image sensors to meet diverse applications and needs. These include:
- trigger synchronisation for controlling imaging timing during high-speed inspections
- Region of Interest (ROI), which reduces post signal processing load by only reading out the required regions
- gradation compression to reduce data volume while outputting required information
- multi-exposure, capable of detecting the trajectory of moving objects
- short exposure time for blur-free imaging of objects moving at high speeds
- pixel binning readout, which can enhance sensitivity in low luminance situations.
Key specifications
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Model name
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IMX661 (color, black and white)
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Unit cell size
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3.45 μm x 3.45 μm (H x V)
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Effective pixels
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13,400 x 9,528 (H x V), 127.68 megapixels
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Image size
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Diagonal 56.73 mm (3.6-type)
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Active area
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46.2 mm x 32.9 mm (H x V)
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Package
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Ceramic LGA
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Micro lens
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EPD -100mm (CRA 15.8 degrees)
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Power supply
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Analog: 3.3V
Digital: 1.2V
Interface: 1.8V
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Output
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4.7Gbps/lane SLVS-EC 16/8/4 lane
891Mbps/lane SLVS 16 lane
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Frame rate
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14 bit: 12.9 fps
12 bit: 19.6 fps
10 bit: 21.8 fps
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Main functions
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Global shutter, trigger synchronization, ROI, gradation compression,
multi-exposure, short exposure, pixel binning readout
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1Among CMOS image sensors equipped with a global shutter. According to Sony research (as of announcement on March 9, 2021).
2Based on image sensor effective pixel specification method.
3A data transfer method that uses an embedded clock signal. This eliminates the need for skew adjustment between lanes and reduces the amount of wiring needed, making board design simpler and suitable for higher speeds.
4Compared to Sony's "IMX253" 1.1 type, 12.37 effective megapixels CMOS image sensor equipped with a global shutter function.
